CMP: The Access to Advanced Low Costy Manufacturing

CMP aims at providing Universities, Research Laboratories and Industries with the possibility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8, DLM/TLM 0.6μ, DLP/4LM 0.35μ, SLP/6LM 0.25μ, SLP/6LM 0.18μ, BiCMOS DLP/DLM 0.8μ, SiGe HBT 0.8μ DLP/DLM, SiGe HBT 0.35μ SLP/5LM and GaAs HEMT 0.2μ. About 40 multi-project runs are offered per year. Micro Electro Mechanical Systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8μ 0.6μ, BiCMOS DLP/DLM 0.8μ and HEMT GaAs 0.2μ, using compatible front-side bulk micro-machining. MUMPS process is offered as a surface micromachining allowing to integrate MEMS only microstructures. Finally, the main processes for Multi-Chip Modules (MCMs) are also accessible through CMP. CMP has introduced very advanced processes during the 3 last years : 0.25um CMOS in 1997, 0.18um CMOS in 1999, 0.5um Silicon On Sapphire in 2000, and the 0.35um HBT BiCMOS in 2001. Those processes represent a challenge for CAD design, applications, and training. We will present the process and design-kits features for those advanced technologies, and give some results on the dissemination and support activity at CMP. Accessing to advanced and state of the art processes gives to the academic/research community the high quality of engineering education and a high quality of research. Proceedings of the 2001 International Conference on Microelectronic Systems Education (MSE’01) 0-7695-1156-2/01 $10.00 © 2001 IEEE